ASC International VisionPro M500 Benchtop 3D SPI Solder Paste Inspection 2017

Description

2017 Vintage VisionPro M500 3D SPI machime
Inspect and sample solder paste samples offline
Attractive Space Saving Design
Best in Class Gage R&R
Measure Height, Area, Volume, X-Y
3D Profiling – Improved Qualitative Analysis
Service Free USB Interface
Long Life LED Lighting
Large ESD Safe Work Surface
High Resolution Color CCD Camera
Dell® PC / 21″ LCD Monitor
Includes Optional NIST Calibration Tool
Specifications
Inspection Speed
.33 Sec/FOV
Z Resolution
.48 μm (.019 mils)
Lateral Resolution (X-Y)
Gage R & R (+/- 50% tolerance on PCB
6.8 um (.27 mils)
<<10%
Height Accuracy on Cal Target
1 μm (.04 mils)
Minimum Paste Deposit Size (X,Y)
51 μm (2 mils
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